JPH0211328U - - Google Patents
Info
- Publication number
- JPH0211328U JPH0211328U JP8969588U JP8969588U JPH0211328U JP H0211328 U JPH0211328 U JP H0211328U JP 8969588 U JP8969588 U JP 8969588U JP 8969588 U JP8969588 U JP 8969588U JP H0211328 U JPH0211328 U JP H0211328U
- Authority
- JP
- Japan
- Prior art keywords
- island
- wiring pattern
- chip
- bonding pad
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8969588U JPH0211328U (en]) | 1988-07-05 | 1988-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8969588U JPH0211328U (en]) | 1988-07-05 | 1988-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0211328U true JPH0211328U (en]) | 1990-01-24 |
Family
ID=31314240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8969588U Pending JPH0211328U (en]) | 1988-07-05 | 1988-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0211328U (en]) |
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1988
- 1988-07-05 JP JP8969588U patent/JPH0211328U/ja active Pending